Two Part Thermal Cure Epoxy Compound - Opaque—雙組分熱

簡(jiǎn)要描述：用Dyesol的兩部熱固化環(huán)氧樹脂密封化合物中建立一個(gè)二級(jí)密封并提供改進(jìn)的機(jī)械性能，密封系統(tǒng)的DSC測(cè)試單元和瓷磚。本產(chǎn)品產(chǎn)品具有很高的耐化學(xué)性和不透明時(shí)，固化。

產(chǎn)品型號(hào)：MS22222
廠商性質(zhì)：代理商
更新時(shí)間：2024-05-16
訪問(wèn) 量：1115

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詳細(xì)介紹

Dyesol’s Two Part Thermal Cure Sealing Compound provides a rigid seal for hermetic enclosure of Dye Solar Cells. It cures at elevated temperature.

This sealing material provides a secondary seal for primary-sealed test cells and tiles, improving the quality of the hermetic enclosure and contributing desirable mechanical characteristics to sealing systems. Recommended for long term testing programs and any testing at elevated temperatures.
Classified as a ‘Dangerous Good (Corrosive/Dangerous for the environment)’, this product incurs a ‘Dangerous Goods’ fee in addition to normal postage and handling to all destinations.

Consider also purchasing: Dyesol’s Thermoplastic Sealants, Neutral Assembly Polymer, and Dyesol’s Screen Printers.

ITEM #	SIZE
MS22222-50	50 grams
MS22222-100	100 grams
MS22222-250	250 grams

SPECIFICATIONS——規(guī)格

Curing Temperature:	120°C
Mixing Ratio:	By Weight 100:15.8
Viscosity (mixed):	18,000 - 22,000 mPa.s measured at shear rate of 10 sec -¹ (25°C)
Pot Life (140g mix):	40-45 minutes

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上一篇：MS11111Two Part Thermal Cure Epoxy Compound - Clear——雙組分熱
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Two Part Thermal Cure Epoxy Compound - Opaque—雙組分熱

SPECIFICATIONS——規(guī)格

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